Manufacture of Microprocessors in PLI
Government has notified Production Linked
Incentive schemes for Large Scale Electronics Manufacturing and IT Hardware
which do not cover manufacturing of microprocessors.
However, Government is focused on its
important objective of building the overall semiconductor ecosystem and ensure
that, it in-turn catalyses India’s rapidly expanding
electronics manufacturing and innovation ecosystem. This vision of AtmaNirbhar Bharat in electronics & semiconductors was
given further momentum by the Union Cabinet, chaired by the Hon’ble Prime
Minister, approving the Semicon India programme with a total outlay of INR 76,000 crore for the
development of semiconductor and display manufacturing ecosystem in our
country. The programme aims to provide financial
support to companies investing in semiconductors, display manufacturing and
design ecosystem. This will serve to pave the way for India’s growing presence
in the global electronics value chains.
Following four schemes have been introduced
under the aforesaid programme:
I.
Scheme for setting up of
Semiconductor Fabs in India provides fiscal support to eligible applicants for setting up
of Semiconductor Fabs which is aimed at attracting
large investments for setting up semiconductor wafer fabrication facilities in
the country. Following fiscal support has been approved under the scheme:
II.
Scheme for setting up of
Display Fabs in India provides fiscal support to eligible applicants for setting up of
Display Fabs which is aimed at attracting large
investments for setting up TFT LCD / AMOLED based display fabrication
facilities in the country. The Scheme provides fiscal support of up to 50% of
Project Cost subject to a ceiling of INR 12,000 crore per Fab.
III. Scheme for setting up of Compound Semiconductors / Silicon Photonics
/ Sensors Fab and Semiconductor Assembly, Testing, Marking and Packaging (ATMP)
/ OSAT facilities in India: The Scheme provides a
fiscal support of 30% of the Capital Expenditure to the eligible applicants for
setting up of Compound Semiconductors / Silicon Photonics (SiPh)
/ Sensors (including MEMS) Fab and Semiconductor ATMP / OSAT facilities in
India.
IV. Design Linked Incentive (DLI) Scheme offers financial incentives, design infrastructure support
across various stages of development and deployment of semiconductor design for
Integrated Circuits (ICs), Chipsets, System on Chips (SoCs),
Systems & IP Cores and semiconductor linked design. The scheme provides
“Product Design Linked Incentive” of up to 50% of the eligible expenditure
subject to a ceiling of ₹15 Crore per application and “Deployment Linked
Incentive” of 6% to 4% of net sales turnover over 5 years subject to a ceiling
of ₹30 Crore per application.
In addition to the above schemes, Government
has also approved modernisation of Semi-Conductor Laboratory,
Mohali as a brownfield Fab.
Government has received three applications
under Semicon India Programme
for setting up of Semiconductor Fabs in India for
manufacturing of semiconductor chips, including microprocessors chips.
Incentive may be extended upto two eligible
applicants with approval of the Union Cabinet.
The applications received under the Semicon India Programme for
manufacturing of chips are yet to be approved subject to the recommendation of
India Semiconductor Mission (ISM). Further, Semiconductors manufacturing is a
very complex and technology-intensive sector with huge capital investments,
high risk, long gestation and payback periods, and rapid changes in technology
which require significant and sustained investments. Presently, India is at
formative stage of developing its semiconductor supply chain ecosystem. The
manufacturing of semiconductor chips, including microprocessors in
semiconductor fab units will depend on technology, capacity and availability of
semiconductor supply chain ecosystem.
This information was given by the Minister of
State for Electronics & Information Technology, Rajeev Chandrasekhar in a
written reply to a question in Rajya Sabha on 25
March 2022.