China Xidian University Develops Low-Cost Infrared Chips, Set to Revolutionize Smartphones and Autonomous Vehicles

Researchers have developed a new way to make high-end infrared chips that could slash their cost and boost smartphone cameras, self-driving cars

· Major Breakthrough

o Researchers at Xidian University developed a new method to produce SWIR infrared chips.

o Could cut costs by up to 99% while maintaining high performance.

· Technology Explained

o Chips detect Short-Wave Infrared (SWIR):

§ Invisible to human eye

§ Can penetrate fog, smoke, and haze

§ Enables imaging in total darkness

· Key Applications

o Smartphones: Enhanced low-light and advanced imaging

o Self-driving cars: Better vision in foggy or low-visibility conditions

o Industrial scanning: Detect defects through packaging

o Robotics: Improved navigation in dark environments

· Problem with Existing Technology

o Current chips use indium gallium arsenide (InGaAs):

§ Very expensive (hundreds to thousands of dollars per chip)

§ Difficult to integrate with standard chip manufacturing

· Innovative Solution

o Team led by Hu Huiyong used:

§ Silicon-germanium

§ Standard CMOS (chip-making process)

o Enables production using existing semiconductor infrastructure

· Cost Advantage

o Estimated cost reduced to ~$10 per chip

o Makes SWIR viable for mass consumer markets

· Technical Challenge Overcome

o Silicon–germanium lattice mismatch (4.2%) causes defects

o Solved using:

§ Buffer layers

§ Heat treatment & chemical sealing

o Achieved high efficiency and low noise performance

· Global Benchmarking

o Performance comparable to leaders like:

§ Sony

§ TSMC

§ Artilux

· Commercialisation Plans

o Production line being built via:

§ Xidian’s Hangzhou Institute

§ Zhixin Semiconductor

o Mass production expected by end of the year

· Strategic Impact

o Shifts SWIR tech from:

§ Military & research use → mainstream consumer use

o Potential to transform:

§ Electronics

§ Automotive safety

§ Industrial automation

[ABS News Service/07.04.2026]

A research team at a Chinese university has developed a new way to make high-end infrared chips that could slash their cost dramatically and improve the performance of smartphone cameras and self-driving cars.

The key breakthrough was finding a way to make the chips using conventional manufacturing techniques, rather than the exotic, costly materials that were relied on before.

Mass production is set to begin by the end of the year, according to a press release from Xidian University.

The chips detect short-wave infrared (SWIR), which is invisible to the human eye and can penetrate fog, haze and smoke. Cameras capable of detecting SWIR can take pictures in total darkness and even see through some materials.

This can allow self-driving cars to see through dense fog, let factory scanners spot faulty products through their packaging and stop humanoid robots from bumping into things in the dark.

But this technology carries a prohibitive price tag, which has limited its use to military applications and high-end scientific research – satellite reconnaissance, drone surveillance and missile guidance.

A single chip can cost anywhere from several hundred to several thousand US dollars.

This is because these chips typically rely on expensive indium gallium arsenide (InGaAs), which is hard to integrate with the most widely used manufacturing processes.

On March 29, Xidian University announced that a research team led by Professor Hu Huiyong had successfully taken a novel approach. They used silicon-germanium and silicon complementary metal-oxide-semiconductor processing – both of which are commonly used to make chips.

According to the researchers, this allowed them to achieve a theoretical cost reduction of up to 99 per cent – which would amount to about US$10 – compared with InGaAs-based chips.

“This means we can produce short wave infrared detectors, which were previously prohibitively expensive, using the same methods and cost base as manufacturing smartphone chips,” team member Wang Liming was quoted as saying in the press release.

But matching the results of expensive materials using cheap ones wasn’t easy.

The distance between the atoms in the crystal lattices of silicon and germanium differs by 4.2 per cent. This mismatch can cause defects in chips and is the main reason this approach to making SWIR chips has not been widely used.

To solve this, the team added buffer layers to cushion the material. They also sealed the chips’ surface using heat treatment and chemical techniques to prevent electrical current from leaking out.

“Whether in detection efficiency or noise control, the team’s achievements have reached or even matched the most advanced levels demonstrated by global industry leaders such as Sony, TSMC [Taiwan Semiconductor Manufacturing Company] and Taiwan-based Artilux,” the press release read.

By leveraging Xidian University’s Hangzhou Institute of Technology and the team’s own company, Zhixin Semiconductor, the researchers have built a complete in-house chain for research and development and production. A dedicated silicon-germanium production line is under construction and set to begin operation by the end of the year.

“This breakthrough will bring SWIR technology from military and high-end labs to civilian use,” the university said.