Semicon India Programme and Design
Linked Incentive (DLI) Scheme
·
23 Chip-Design Projects Sanctioned for
Financial Support under Design Linked Incentive (DLI) Scheme to support domestic
companies, startups, and MSMEs in semiconductor design
·
278 Academic Institutions and 72 Startups
Access Advanced Electronics Design Automation(EDA) Tools
under DLI
·
20 chip designs from 17 academic institutions
are successfully fabricated by SCL, Mohali
·
DLI Scheme Addresses High Entry Barriers
and Long Timelines in Semiconductor Product Design and Commercialization
Semicon India
Programme – Key Highlights
Total
Outlay: ₹76,000 crore
·
Aimed at building a semiconductor and display
manufacturing ecosystem in India.
Design
Linked Incentive (DLI) Scheme
Purpose:
To support domestic companies, startups, and
MSMEs in semiconductor design and commercialization, overcoming:
·
High entry barriers,
·
Long development cycles,
·
Global competition.
Outlay:
₹1,000 crore
Key
Incentives Provided:
1.
Design Infrastructure Support
o
Access to EDA tools and IP cores for
early-stage prototyping.
2.
Financial Incentive
o
Up to 50% of eligible design costs (capped
at ₹15 crore per application).
3.
Commercialization Incentive
o
6% to 4% of net sales turnover for 5
years, capped at ₹30 crore per application.
Progress
Since Launch (Dec 2021):
|
Category |
Details |
|
Academic
Institutions |
278
approved under Chip to Startup (C2S) program |
|
Startups |
72
approved for access to EDA tools |
|
Financial
Support Sanctioned |
23
firms/startups for chip designs (e.g., surveillance, energy, networking) |
|
VC
Funded Firms |
10
companies raised funding for commercialization |
|
Prototype
Tape-outs |
6
companies completed at foundries |
|
Fabricated
Designs |
20 chip
designs from 17 academic institutions fabricated at SCL, Mohali |
|
Total
Approved Projects |
₹803.08
crore including EDA infrastructure |
Implementation:
·
Milestone-based funding disbursal
·
Projects at different stages of chip design and
development
·
Implemented with active industry consultation;
open to future modifications based on feedback
The Government
has approved the ‘Semicon India Programme’ with a total
outlay of ₹76,000 crore for the development of a semiconductor and display
manufacturing ecosystem in the country.
As part of this,
the ‘Design Linked Incentive (DLI) Scheme’ has been approved with an outlay of ₹1,000
crore to support domestic companies, startups, and MSMEs in semiconductor design.
Designing and commercializing
a semiconductor product involves high entry barriers, long development timelines,
and global competition. To address these challenges, the DLI Scheme provides for
the following:
·
Design infrastructure support, such as Electronic Design
Automation (EDA) tools and Intellectual Property (IP) cores, to help with early
prototyping of designs
·
Financial incentive of up to 50% of eligible costs,
capped at ₹15 cr/application, for design prototyping,
scaling-up, and volume production
·
Incentives of 6% to 4% of net sales turnover over five
years, capped at ₹30 cr/application, for deployment
& commercialization of chip solutions
Under DLI, since its launch in December 2021:
·
278 academic institutions (C2S) and 72 startups (DLI)
have been approved for access to state-of-the-art Electronic Design Automation (EDA)
tools
·
23 firms & startups are sanctioned financial support
for designing chips for surveillance camera, energy meter, microprocessor IPs, networking
applications etc.
·
Out of these, ten (10) companies have raised venture
capital (VC) funding for scaling up their design prototypes for commercialization
·
Six (6) companies have completed prototype tape-outs
at various semiconductor foundries
Recently, 20 chip
designs from 17 academic institutions have been successfully fabricated by SCL,
Mohali.
A total project
outlay of ₹803.08 crore, including the cost of EDA tools, has been approved
under the DLI Scheme. These projects are at various stages of semiconductor design
and development. The release of funds under the scheme are linked with the achievement
of defined milestones, including the deployment of chips.
The DLI Scheme
is implemented in close consultation with stakeholders and beneficiary companies.
Any modifications needed will be done based on evolving requirements and feedback.
This information
was submitted by Union Minister of Electronics and Information Technology Jitin
Prasada in Lok Sabha 30 July, 2025.